序号 | 测试项目 | 测试条件 | 测试要求 |
1 | Preconditioning | (1) 工作状态:JESD22-A113 flow
(2) 温度：
(3) 试验时间：336hrs
(4) 样品数量：300ea (total) | After PC: HAST / UHST / TC / PTC
Test (before / after) : room temp. |
2 | Temperature- Humidity-Bias or Biased HAST | (1)工作状态：Biased
(2) 温度：130°C / RH: 85% ;
(3) 试验时间：96h（264hrs）
(4) 样品数量：30ea * 3 lots | Test (before / after) : room and hot temp. |
3 | Autoclave or Unbiased HAST or Temperature- Humidity (without Bias) | (1) 工作状态：无
(2) 温度：130°C / RH: 85% ;
(3) 试验时间：96hrs（264hrs）
(4) 样品数量：30ea * 3 lots | Test (before / after) : room temp. |
4 |
Temperature Cycling | (1)工作状态：无
(2) 温度：-40°C ~ 85°C
(3) 试验时间：1000cycles
(4) 样品数量：30ea * 3 lots | Grade3: -40°C ~ 85°C for 1000 cycles
TEST before and after TC at hot temperature. For encapsulated packages, include pre- and post-Acoustic Microscopy (see AM).
After completion of TC, decap five MCMs from one lot and perform WBP and WPS tests on corner bonds (2 bonds per corner) and one mid-bond per side on each device. See AEC-Q100 Appendix 3 for preferred decap procedure to minimize damage and false data. |
5 | Power Temperature Cycling | (1)工作状态：Biased
(2) 温度：-40°C ~ 105°C
(3) 试验时间：1000cycles
(4) 样品数量：30ea * 1 lot | Grade3: -40℃ ~ 105℃ for 1000 cycles
Test (before / after) : room and hot temp. |
6 | High Temperature Storage Life | (1)工作状态：无
(2)温度：Tmax ambient operating temperature (85℃)+J14
(3) 试验时间：1000hrs
(4) 样品数量：30ea * 1 lot | Grade3: 85℃ for 1000 hrs
Test (before / after) : room and hot temp. |
7 | High Temperature Operating Life | (1) 工作状态：Biased
(2) 高温： 85°C
(3) 试验时间：1000hrs
(4) 样品数量：30ea * 3 lots | Grade3: Vcc maximum 1000hrs with 85℃
Test (before / after) : room, cold and hot temp. |
8 | Early Life Failure Rate | (1) 工作状态：Biased
(2) 高温： 85°C
(3) 试验时间：48hrs
(4) 样品数量：231ea * 1 lot | Grade3: Vcc maximum 48hrs with 85℃
Test (before / after) : room temp. |
9 | NVM Endurance,
Data Retention, and Operational Life | (1) 工作状态：Biased
(2) 高温： 85°C
(3) 试验时间：1000hrs
(4) 样品数量：30ea * 3 lots | Data retention can be performed on the individual components in accordance with AEC-Q100. |
10 | Wire Bond Shear | (1) 工作状态：
(2) 样品数量：30bonds * 5 devices
| Cpk>1.67
At appropriate time interval for each bonder to be used |
11 | Wire Bond Pull | (1) 工作状态：
(2) 样品数量：30bonds * 5 devices
| Cpk>1.67
Condition C or D. |
12 | Solderability
MCM External Leads | (1) 工作状态：
(2) 样品数量：15ea * 1 lot
| If burn-in screening is normally performed on the MCM before shipment, samples for SD must first undergo burnin. Perform 8 hour steam aging prior to testing (1 hour for Au-plated leads). The customer can request justification for using dry bake in place of steam aging. Note there are circumstances that the Board Level Reliability testing per IPC-9701 can replace this test. |
13 | Physical Dimensions | (1) 工作状态：
(2) 样品数量：10ea * 3 lots
| Cpk>1.67 |
14 | X-Ray | (1) 工作状态：
(2) 样品数量：5ea * 1 lot
| Required to document MCM construction. Not a qualification test. |
15 | Acoustic Microscopy | (1) 工作状态：
(2) 样品数量：10ea * 3 lots
| Only required for surface mount MCMs that have monolithic construction as included in IPC/JEDEC J-STD-020. Perform delamination check after TC. AM with 10 samples per lot. Delamination is not allowed, if it occurs in the area of wire bond interconnects or if it changes the thermal behavior of the MCM in a way, that it is out of specification. |
16 | Electrostatic Discharge Human Body Model | (1) 工作状态：
(2) 样品数量：1 lot (估計30ea)
| TEST before and after ESD at room and hot temperature.
HBM < 1000V require customer notification |
17 | Electrostatic Discharge Charged Device Model | (1) 工作状态：
(2) 样品数量：1 lot (估計6ea)
| TEST before and after ESD at room and hot temperature.
CDM < 500V require customer notification |
18 | Latch-Up | (1) 工作状态：
(2) 样品数量：6ea * 1 lot
| TEST before and after LU at room and hot temperature. |
19 | Electromagnetic
Compatibility | (1) 工作状态：
(2) 样品数量：1ea * 1 lot
| This test and its accept criteria are per agreement between user and supplier on a case-by-case basis. |
20 | Soft Error Rate | (1) 工作状态：
(2) 样品数量：3ea * 1 lot
| This test and accept criteria are per agreement between user and supplier on a
case-by-case basis. Final test report shall include detailed test facility location and altitude data. |
21 | Board Level
Reliability | (1) 工作状态：
(2) 样品数量：32ea * 1 lot | Report initial and 50% failure cycles per IPC-9701 |
22 | Low Temperature
Storage Life | (1) 工作状态：
(2) 温度：-40°C
(3) 样品数量：30ea * 1 lot | 1000 hours at minimum ambient operating temperature.
Test (before / after) : room, cold and hot temp. |
23 | Start Up and Temperature Steps | (1) 工作状态：
(2) 样品数量：5ea * 1 lot
| Start up at cold and hot temperature and ramp in 10°C increments. Confirm functionality at each step within the
device specified operating range. |
24 | MCM Drop Test | (1) 工作状态：
(2) 样品数量：6ea * 1 lot
| Condition B (1500 G, 0.5 ms half-sine pulse, equivalent drop height 112 cm), as listed in JESD22-B110B. For referencing purposes, 30 of drops are recommended. |
25 | Destructive Physical Analysis | (1) 工作状态：
(2) 样品数量：5ea * 1 lot
| After MCM thermal cycling exposure, check key risks based on the MCM DFMEA and PFMEA. |