电子元器件怎样区分假冒翻新？如何进行假冒翻新料鉴别？
发布时间：2021-11-08 08:57:04
电子元器件怎样区分假冒翻新？如何进行假冒翻新料鉴别？
AS6081标准简介
AS6081是SAE（国际自动机工程师学会）所制定的航空航天质量管理体系标准，定义了一组严格的防止伪劣料件进入全球供应链的系统化实践，研究如何避免、检测、减少和处置伪劣料件，从而保护全球电子市场免受其害。
通过AS6081标准检验的每一批元器件，意味着获得该认证的电子元器件/供应商在料件保真方面具有更强的能力，是客户，尤其是航天航空领域客户值得信赖的可靠供应商。
通过严格执行AS6081标准的每一个检测项目，让大家更了解并对客户与供应商之间关系充满信心。同时通过AS6081标准检验还可以提高对产品可追溯性方面的风险管理，以确保任何问题都可以在供应链的任何环节中识别并及时处理。
不管元器件是安装在飞机上还是消费电子产品上，通过AS6081标准测试都会确保客户及时获取采购/使用的每一批元器件是否是正品信息。
TABLE 1 - LOT SAMPLING PLAN
| Test/Inspection | Minimum Sample Size | Level |
| | Lot Size 200 or greater Devices | Lot Size 1-199 Devices (See NOTE 1) | |
| Documentation and Packaging | | | A1 |
| Documentation and Packaging Inspection (4.2.6.4.1) (non-destructive) | All devices | All devices | |
| External Visual Inspection | | | A2 |
| a. General (4.2.6.4.2.1) (non-destructive) | All devices | All devices | |
| b. Detailed (4.2.6.4.2.2) (non-destructive) | 122 devices | 122 or all devices, whichever is less | |
| Remarking & Resurfacing (destructive) | See NOTE 2 | See NOTE 2 | A3 |
| Solvent Test for Remarking (4.2.6.4.3 A) (destructive) | 3 devices | 3 devices | |
| Solvent Test for Resurfacing (4.2.6.4.3 B) (destructive) | 3 devices | 3 devices | |
| Radiological (X-Ray) Inspection | | | A4 |
| X-Ray Inspection (4.2.6.4.4) (non-destructive) | 45 devices | 45 devices or all devices, whichever is less | |
| Lead Finish Evaluation (XRF or EDS/EDX) | See NOTE 3 | See NOTE 3 | A5 |
| XRF (non-destructive) or EDS/EDX (destructive) (4.2.6.4.5) (Appendix C.1) | 3 devices | 3 devices | |
| Delid/Decapsulation Internal Analysis (destructive) | See NOTE 4 | See NOTE 4 | A6 |
| Delid/Decapsulation (4.2.6.4.6) (destructive) | 3 devices | 3 devices | |
| Remarking & Resurfacing (destructive) | See NOTE 2 | See NOTE 2 | A3 Option |
| Scanning Electron Microscope (4.2.6.4.3 C) (destructive) | 3 devices | 3 devices | |
| Quantitative Surface Analysis (4.2.6.4.3 D) (non-destructive) | 5 devices | 5 devices | |
| Thermal Testing | | | Level B |
| Thermal Cycling Test (Appendix C.2) | All devices | All devices | |
| Electrical Testing | | | Level C |
| Electrical Testing (Appendix C.3) | 116 devices | All devices | |
| Burn-In | | | Level D |
| Burn-In (Pre & Post) (Appendix C.4) | 45 Devices | 45 devices or all devices, whichever is less | |
| Hermeticity Verification (Fine and Gross Leak) | | | Level E |
| Hermeticity Verification (Fine and Gross Leak) (Appendix C.5) | All devices | All devices | |
| Scanning Acoustic Microscopy (SAM) | | | Level F |
| Scanning Acoustic Microscopy (SAM) (Appendix C.6) | As specified | As specified | |
| Other | | | Level G |
| Other test/inspections | As specified | As specified | |
市场应用-假冒翻新料鉴别
检测需求
鉴于外部环境影响，大量的假冒伪劣元器件已经流入我国装备和整机设备的供应链系统
检测手段
通过与原装产品对比：外观、材料、结构、制造工艺、电性能，有效暴露出伪劣元器件缺陷、矛盾之处
检测效果
假冒器件的鉴别已经成为保证元器件使用和装备可靠性非常有效的手段
（协助加强供应商管控，消除潜在风险，提高产品可靠性。协助减少上下游经济纠纷，提高企业形象及信誉）
常用检测方法
OM-圆弧倒角
OM-切筋露铜
OM-正面喷涂/MARK点/与背面侧面注塑形貌区别
OM-BGA重新植球助焊剂/侧面夹痕
X光-DIE侧、金线/铜线、固晶胶空洞
Decap-DIE Logo 、键合质量（推拉力/弹坑/IMC）、版图
SEM/EDS-键合线直径、钝化层完整性、划片道质量
EDS-键合线材质、固晶胶材质、镀层材质