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广电计量 杜亚俊 先生

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AEC-Q102与AEC-Q101有什么区别?

发布时间:2020-05-18 11:21:16
AEC-Q102与AEC-Q101区别一览表
类型
AEC-Q101
AEC-Q102
适用对象
对象:车用分立半导体元器件
晶体管:BJT、MOSFET、IGBT
二极管:Diodes、Rectifier、Zeners、PIN、Varactors
光器件:LEDs、Optocoupler、Photodiodes、Phototransistors
   
对象:车用分立光电半导体元器件       
Light Emitting Diodes、Laser Components、Photodiodes、Phototransistors
   
样本量
环境应力试验:3lot×77pcs/lot
LTPD(Lot Tolerance Percent Defective) = 1, 90%置信度的失效率为1%
   
环境应力试验:3lot×26pcs/lot
LTPD (Lot Tolerance Percent Defective) = 3, 90%置信度的失效率为3%
失效判据
不符合规格书规定的电学和光学参数范围
环境试验前后参数值变化未保持在±20%以内;漏电未保持在5倍初始值以内(对于湿气试验为10倍)
由于环境试验出现物理损坏
如果失效原因被供应商和用户认为是由于处理不当或ESD的原因引起,这些失效可以被忽略,但应呈现在报告中
   
不符合规格书规定的电学和光学参数范围
环境试验前后参数值变化未保持在附录5规定的±x%以内
由于环境试验出现物理损坏(迁移、腐蚀、机械破坏、分层等);有些物理损坏可能由供应商和用户同意认为仅仅是外观不良而不影响认证结果;
如果失效原因被供应商和用户认为是由于处理不当、测试板连接、ESD或其它跟测试条件无关的原因引起,这些失效可以被忽略,但应呈现在报告中
应力前后参数测试
高温工作
施加最大偏置5a HTOL1:最高允许工作温度条件下施加一定的驱动电流使得结温达到最高允许值
5b HTOL2:为最大驱动电流条件下选择工作温度使得结温达到最高允许值
无需降额时,5a=5b
温度循环
低温-55℃,高温为最高结温(不超过150℃)低温-40℃,高温根据焊点温度调整
高温高湿
Ta=85℃/85%RH,器件施加额定正向偏置6a WHTOL1:双85条件下施加一定的驱动电流使得结温达到最高允许值,30min开/30min关
6b WHTOL2:双85条件下施加最小驱动电流、如无最小电流则施加不使结温超3K的驱动电流
功率温度循环
温升≥100℃低温-40℃,高温根据焊点温度来定
DPA
从完成H3TRB或HAST、TC试验的样品中,每项随机抽取2个样品完成功率温度循环(PTC)/间歇工作寿命(IOL)、高温高湿工作(WHTOL1、WHTOL2)/高温高湿反偏(H3TRB)、硫化氢腐蚀(H2S)、混合气体腐蚀(FMG)试验的样品中随机抽取2只/批
热阻
JESD24-3(MOS),JESD24-4(BJT),JESD24-6(IGBT)JESD51-50、JESD51-51、JESD51-52,针对LED
AEC-Q101标准要求
5b
高温工作High Temperature Forward Bias
HTFB
1
DGUZ
77
3 Note B
0
JESD22 A-108
1000 hours at the maximum forward bias,TEST before and after HTFB as a minimum.
7
温度循环Temperature Cycling
TC
1
DGU
77
3 Note B
0
JESD22 A-104 Appendix 6
1000 cycles(TA=minimum range of -55℃ to maximum rated junction  temperature,not to exceed 150℃).Can reduce duration to 400 cycles using TA(max)=25℃ over part maximum rated junction    temperature or using TA(max)=175℃ if the maximum rated junction temperature is above 150℃.TEST before and after TC
9a
高温高湿High Temperature High Humidity Bias
HTHHB
1
DGUZ
77
3 Note B
0
JESD22 A-101
1000 hours at TA=85℃/85%RH with part Forward    biased.TEST before and after H3TRB as a minimum
10
      alt
功率温度循环Power and Temperature Cycle
PTC
1
DGTUW
77
3 Note B
0
JESD22 A-105
Perform PTC if △TJ≥100℃ can    not be achieved with IOL. Tested per duration indicated for timing    Requirements in Table 2A.Parts Powered and Chamber cycled to insure    △TJ≥100℃(not to exceed absolute maximum ratings).
TEST before and after PTC as a minimum.
12
DPA Destructive Physical Analysis
DPA
1
DG
2
1 Note B
0
AEC-Q101-004 Section 4
Random sample of parts that have    successfully completed H3TRB or HAST, and TC.
22
热阻Thermal Resistance
TR
3
DG
10 each,pre-&post-change
1
0
JESD24-3,24-4,24-6 as appropriate
Measure TR to assure    specification compliance and provide process change comparison data.
AEC-Q102标准要求
5a
高温工作High Temperature Operating Life HTOL
HTOL1
D,G,X,Y
26
3 Note B
0
JEDEC JESD22-A108
Only for LED and Laser    Component
Duration 1000 h at maximum Specified Tsolder,choose corresponding drive    current according to derating curve to achieve max Tj defined in the part    specification.Test 5a is equivalent to 5b if no derating.For use within    specical application; a longer test duration my be needed to ensure    reliability over aplication lifetime.For details,see Appendix    7a"Reliability Validation for LEDs"
Test before and after HTOL1
5b
高温工作High Temperature Operating Life HTOL
HTOL2
D,G,X,Y
26
3 Note B
0
JEDEC JESD22-A108
Only for LED and Laser    Component
Duration 1000 h at maximum Specified drive current,Choose corresponding    Tsolder according to derating curve to achieve max Tj defined in the part    specification.Test 5b is equivalent to 5a if no derating.For use within    specical application; a longer test duration my be needed to ensure    reliability over aplication lifetime.For details,see Appendix    7a"Reliability Validation for LEDs"
Test before and after HTOL2
7
温度循环Temperature Cycling
TC
D,G
26
3 Note B
0
JEDEC JESD22-A104
PC before TC
Duration 1000 cycles.Minimum soak & dwell time 15 min.Minimum    temperature as specified in part specification. Choose TC condition exceeding    or equal to the operating temperature according to the apporopriate part    specification:
TC condition 1:max Tsolder=85℃
TC condition 2:max Tsolder=100℃
TC condition 3:max Tsolder=110℃
TC condition 4:max Tsolder=125℃
TC condition and tranfer time shall be mentioned    in the test report.
It is recommended to  decapsulate the    part after TC and perform WBP if applicable.Report data.The supplier has to    provide explanation in case that WBP cannot be performed.
TEST before and after TC.
6a
高温高湿Wet High Temperature Operating Life
WHTOL1
D,G,X,Y
26
3 Note B
0
JEDEC JESD22-A101
Only for LED and Laser    Component
PC before WHTOL1
Duration 1000 h at Tsolder=85℃/85%RH    with drive current according to derating curve to    achieve max Tj defined in the part specification.Operated with power cycle 30 min on /30 min off
Test before and after WHTOL1,DPA after WHTOL1
6b
高温高湿Wet High Temperature Operating Life
HTOL2
D,G,X,Y
26
3 Note B
0
JEDEC JESD22-A101
Only for LED and Laser    Component
PC before WHTOL2
Duration 1000 h at Tsolder=85℃/85%RH with minimum drive current according    to part specification.If no minimum rated drive  current is specified, a drive current shall    be chosen not  to exceed a rise of 3K    for Tjunction.
Test before and after WHTOL2,DPA after WHTOL2
8a
功率温度循环Power Temperature Cycling
PTC
D,G,X,Y
26
3 Note B
0
JEDEC JESD22-A105
Only for LED and Laser    Component
PC before PTC
Duration 1000 temperature cycles with drive current according to derating    curve to achieve max Tj specified in part specification.
Operated with power cycle 5 min on/ 5 min off.
Minimum temperature as specified in part specification. For maximum    temperature choose:
PTC condition 1:max Tsolder=85℃
PTC condition 2:max Tsolder=105℃
PTC condition 3:max Tsolder=125℃
PTC condition should be chosen closest to the    operating temperature range within the appropriate part specification. PTC    condtion shall be mentioned in the test report. For use within special    application; a longer test duration may be needed to ensure reliability    over  application liftime.For    details.see Appendix 7a "Reliability Validation for LEDs"
TEST before and after PTC.DPA after PTC.
11
DPA Destructive Physical Analysis
DPA
D,G
2(for each test)
1 Note B
0
Appendix 6
Random sample of parts that have    successfully completed PTC/IOL.WHTOL/H3TRB,H2S,and FMG(2 samples each)
24
热阻Thermal Resistance
TR
D,G,X,Y
10 each,pre-&post-change
1
0
JEDEC
  JESD51-50
  JESD51-51
  JESD51-52
Measure thermal resistance    according to JESD51-50, JESD51-51,and     JESD51-52 to assure specification compliance.
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