AEC-Q100标准解读之预处理Precondition Test (PC)

发布时间:2022-07-26 09:42:51
AEC-Q100标准解读之预处理Precondition Test (PC),参考标准,目的及试验条件。
试验项目:Precondition Test (PC)
参考标准:JEDEC J-STD-020 、JESD22-A113; 
目的:模拟IC在使用之前在一定湿度,温度条件下存储的耐久力,也就是IC从生产到使用之间存储的可靠性;
失效机制:封装破裂,分层;
试验通过判断依据:芯片试验完成后FT常温测试pass、超声扫描结果pass;
实验室能力范围:可以做MSL4到MSL1任意等级的PC;
试验条件:
Performed on surface mount devices only. PC performed before THB/HAST, AC/UHST, TC, and PTC stresses. It is recommended that J-STD-020 be performed to determine what preconditioning level to perform in the actual PC stress per JA113. The minimum acceptable level for qualification is level 3 per JA113. Where applicable, preconditioning level and Peak Reflow Temperature must be reported when preconditioning and/or MSL is performed. Delamination from the die surface in JA113/J-STD-020 is acceptable if the device passes the subsequent Qualification tests. Any replacement of devices must be reported. 
TEST before and after PC at room temperature.
需求确认:需客户确认试验的MSL等级。

目前国内PC试验大部分都是按照J-STD-020 里面的MSL 3要求做的
友情链接:
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